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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. Q3-0.005-00-86

Bergquist - Q3-0.005-00-86

KEY Part #: K6149351

Q3-0.005-00-86 Pricing (USD) [799327PC Stock]

  • 1 pcs$0.08526
  • 1,800 pcs$0.08483
Nimewo Pati:
Q3-0.005-00-86
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 39.62MMX26.67MM BLACK. Thermal Interface Products Glass-Reinforced Grease Replacement Thermal Interface, 0.005" Thickness, 1.56x1.05x0.156", 4 Leads, Sil-Pad TSP Q2000 Series / Also Known as Bergquist Q-Pad 3 Seri
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Pwodwi pou Telefòn, Tèmik - adezif, epoksi, grès, kole, Fanatik AC, DC Fans, Tèmik - Kousinen, Dra, Fanatik - Pwodwi pou Telefòn, Tèmik - tiyo Chalè, Cham vapè and Tèmik - lavabo yo ...
Avantaj konpetitif:
We specialize in Bergquist Q3-0.005-00-86 electronic components. Q3-0.005-00-86 can be shipped within 24 hours after order. If you have any demands for Q3-0.005-00-86, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

Q3-0.005-00-86 Atribi pwodwi yo

Nimewo Pati : Q3-0.005-00-86
Manifakti : Bergquist
Deskripsyon : THERM PAD 39.62MMX26.67MM BLACK
Seri : Q-Pad® 3
Estati Pati : Active
Itilizasyon : TO-3
Kalite : Pad, Sheet
Fòm : Rhombus
Deskripsyon : 39.62mm x 26.67mm
Pesè : 0.0050" (0.127mm)
Materyèl : Elastomer
Adezif : -
Fè bak, Carrier : Fiberglass
Koulè : Black
Rezistivite tèmik : 0.35°C/W
Konductivite tèmik : 2.0 W/m-K

Dènye nouvèl

Bergquist Company GAP PAD HC 5.0 Thermal Interface
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