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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. 375024B00032G

Aavid, Thermal Division of Boyd Corporation - 375024B00032G

KEY Part #: K6264841

375024B00032G Pricing (USD) [12035PC Stock]

  • 1 pcs$3.42424
Nimewo Pati:
375024B00032G
Manifakti:
Aavid, Thermal Division of Boyd Corporation
Detaye deskripsyon:
HEATSINK BGA W/ADHESIVE TAPE. Heat Sinks Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 40x40x18mm, IC Pkg Size = 40 x 40, Tape #32
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - adezif, epoksi, grès, kole, Tèmik - Pwodwi pou Telefòn, Tèmik - tiyo Chalè, Cham vapè, Tèmik - tèrmoelèktrik, asanble Peltier, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - Likid Refwadisman, Tèmik - Thermoelectric, Peltier Modules and Fanatik - Pwodwi pou Telefòn ...
Avantaj konpetitif:
We specialize in Aavid, Thermal Division of Boyd Corporation 375024B00032G electronic components. 375024B00032G can be shipped within 24 hours after order. If you have any demands for 375024B00032G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

375024B00032G Atribi pwodwi yo

Nimewo Pati : 375024B00032G
Manifakti : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : HEATSINK BGA W/ADHESIVE TAPE
Seri : -
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : BGA
Metòd Atachman : Thermal Tape, Adhesive (Included)
Fòm : Square, Pin Fins
Longè : 1.575" (40.00mm)
Lajè : 1.575" (40.01mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.709" (18.00mm)
Disipasyon pouvwa @ monte tanperati : 2.0W @ 30°C
Rezistans tèmik @ fòse Air koule : 4.30°C/W @ 200 LFM
Rezistans tèmik @ natirèl : 12.00°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Dènye nouvèl

Aavid, Thermal Division of Boyd Corporation Hi-Contact™ Liquid Cold Plates
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