Tèmik - adezif, epoksi, grès, kole

Imaj Pati KLE # / Manifakti Deskripsyon / PDF Kantite / RFQ
TC1-10G

TC1-10G

Chip Quik Inc.

HEAT SINK COMPOUND - HIGH DENSIT.

10448PC Stock

TC1-200G

TC1-200G

Chip Quik Inc.

HEAT SINK COMPOUND - HIGH DENSIT.

1871PC Stock

TC1-20G

TC1-20G

Chip Quik Inc.

HEAT SINK COMPOUND - HIGH DENSIT.

7220PC Stock

Paj Klasifikasyon