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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 32-6556-21

Aries Electronics - 32-6556-21

KEY Part #: K3350756

32-6556-21 Pricing (USD) [5526PC Stock]

  • 1 pcs$7.49393
  • 5 pcs$7.45664
Nimewo Pati:
32-6556-21
Manifakti:
Aries Electronics
Detaye deskripsyon:
CONN IC DIP SOCKET 32POS GOLD. IC & Component Sockets 32 SCKT RECEPT GOLD WIRE WRAP
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Konèkteur Backplane - Kontak, Tèminal - Konektè tourèl, Blòk Tèminal - Blòk Baryè, Konektè rektangilè - Tèt, Bèk, Sockets Fi, Konèkteur Backplane - Espesyalize, Konèkteur Backplane - ARINC Insérer, D-Sub, D-an fòm Konnektè - Housings and Tèminal blòk - Modil Entèfas ...
Avantaj konpetitif:
We specialize in Aries Electronics 32-6556-21 electronic components. 32-6556-21 can be shipped within 24 hours after order. If you have any demands for 32-6556-21, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

32-6556-21 Atribi pwodwi yo

Nimewo Pati : 32-6556-21
Manifakti : Aries Electronics
Deskripsyon : CONN IC DIP SOCKET 32POS GOLD
Seri : 6556
Estati Pati : Active
Kalite : DIP, 0.6" (15.24mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) : 32 (2 x 16)
Pitch - kwazman : 0.100" (2.54mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 30.0µin (0.76µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Open Frame
Revokasyon : Wire Wrap
Pitch - Post : 0.100" (2.54mm)
Kontakte Fini - Post : Gold
Kontakte Fini Epesè - Post : 10.0µin (0.25µm)
Kontakte Materyèl - Post : Brass
Materyèl Lojman : Polyphenylene Sulfide (PPS), Glass Filled
Operating Tanperati : -
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