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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 169-PLS13001-12

Aries Electronics - 169-PLS13001-12

KEY Part #: K3343327

169-PLS13001-12 Pricing (USD) [1620PC Stock]

  • 1 pcs$26.87538
  • 2 pcs$26.74168
Nimewo Pati:
169-PLS13001-12
Manifakti:
Aries Electronics
Detaye deskripsyon:
CONN SOCKET PGA ZIF GOLD. IC & Component Sockets
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèminal blòk - Pwodwi pou Telefòn - Jumpers, D-Sub, D-ki gen fòm Connectors - backshells, Hoods, Kalite Konnektè pouvwa, Tèminal blòk - Pwodwi pou Telefòn - Makè Ti bann, Barik - Audio Connectors, Sockets pou ICS, Transistors - cartes, Terminals - Foil Connectors and Modilè Konektè - Pwodwi pou Telefòn ...
Avantaj konpetitif:
We specialize in Aries Electronics 169-PLS13001-12 electronic components. 169-PLS13001-12 can be shipped within 24 hours after order. If you have any demands for 169-PLS13001-12, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

169-PLS13001-12 Atribi pwodwi yo

Nimewo Pati : 169-PLS13001-12
Manifakti : Aries Electronics
Deskripsyon : CONN SOCKET PGA ZIF GOLD
Seri : PLS
Estati Pati : Active
Kalite : PGA, ZIF (ZIP)
Nimewo nan pozisyon oswa Pins (gri) : -
Pitch - kwazman : 0.100" (2.54mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 30.0µin (0.76µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Closed Frame
Revokasyon : Solder
Pitch - Post : 0.100" (2.54mm)
Kontakte Fini - Post : Tin
Kontakte Fini Epesè - Post : 200.0µin (5.08µm)
Kontakte Materyèl - Post : Beryllium Copper
Materyèl Lojman : Polyphenylene Sulfide (PPS)
Operating Tanperati : -65°C ~ 125°C
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