Laird Technologies EMI - 67SLG050060050PI00

KEY Part #: K7358942

67SLG050060050PI00 Pricing (USD) [423786PC Stock]

  • 1 pcs$0.08728
  • 850 pcs$0.07864
  • 1,700 pcs$0.07036
  • 2,550 pcs$0.06415
  • 5,950 pcs$0.06001
  • 21,250 pcs$0.05588
  • 42,500 pcs$0.05298

Nimewo Pati:
67SLG050060050PI00
Manifakti:
Laird Technologies EMI
Detaye deskripsyon:
METAL FILM OVER FOAM CONTACTS.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: RFI ak EMI - Pwoteksyon ak absòbe materyèl yo, RF transmisèteur ICs, RF Misc ICS ak Modil yo, RF Antèn, RF Front End (LNA + PA), RF Transceiver Modules, RFID Reader Modules and Récepteurs RF ...
Avantaj konpetitif:
We specialize in Laird Technologies EMI 67SLG050060050PI00 electronic components. 67SLG050060050PI00 can be shipped within 24 hours after order. If you have any demands for 67SLG050060050PI00, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

67SLG050060050PI00 Atribi pwodwi yo

Nimewo Pati : 67SLG050060050PI00
Manifakti : Laird Technologies EMI
Deskripsyon : METAL FILM OVER FOAM CONTACTS
Seri : SMD Grounding Metallized
Estati Pati : Active
Kalite : Film Over Foam
Fòm : Rectangle
Lajè : 0.197" (5.00mm)
Longè : 0.197" (5.00mm)
Wotè : 0.236" (6.00mm)
Materyèl : Polyurethane Foam, Tin-Copper Polyester (SN/CU)
PLATING : -
PLATING - Epesè : -
Metòd Atachman : Solder
Operating Tanperati : -40°C ~ 70°C