Manifakti :
Chip Quik Inc.
Deskripsyon :
THERMALLY STABLE SOLDER PASTE NO
Konpozisyon :
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Pwen fizyon :
281°F (138°C)
Fòm :
Syringe, 1.23 oz (35g), 10cc
Lavi etajè kòmanse :
Date of Manufacture
Tanperati Depo / Refrijerasyon :
68°F ~ 77°F (20°C ~ 25°C)