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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

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Chip Quik Inc. - TS391SNL250

KEY Part #: K6372333

TS391SNL250 Pricing (USD) [1336PC Stock]

  • 1 pcs$32.40783
Nimewo Pati:
TS391SNL250
Manifakti:
Chip Quik Inc.
Detaye deskripsyon:
THERMALLY STABLE SOLDER PASTE NO. Solder Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Desoldering galon, mèch, ponp, Titilè, kanpe, Souding, Desoldering, Remanjeman Konsèy, bouch, Pwodwi pou Telefòn, Stentils soude, Modèl, Soude, Souding, Desoldering, Estasyon pou retabli and Distribitè, Distribitè Konsèy yo ...
Avantaj konpetitif:
We specialize in Chip Quik Inc. TS391SNL250 electronic components. TS391SNL250 can be shipped within 24 hours after order. If you have any demands for TS391SNL250, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

TS391SNL250 Atribi pwodwi yo

Nimewo Pati : TS391SNL250
Manifakti : Chip Quik Inc.
Deskripsyon : THERMALLY STABLE SOLDER PASTE NO
Seri : -
Estati Pati : Active
Kalite : Solder Paste
Konpozisyon : Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Dyamèt : -
Pwen fizyon : 423 ~ 428°F (217 ~ 220°C)
Kalite Flux : No-Clean
Fil Kalib : -
Pwosesis : Lead Free
Fòm : Jar, 8.8 oz (250g)
Lavi etajè : 12 Months
Lavi etajè kòmanse : Date of Manufacture
Tanperati Depo / Refrijerasyon : 68°F ~ 77°F (20°C ~ 25°C)
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