Nimewo Pati :
ICF-318-T-O
Deskripsyon :
CONN IC DIP SOCKET 18POS TIN
Kalite :
DIP, 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
18 (2 x 9)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Tin
Kontakte fini epesè - kwazman :
-
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Surface Mount
Karakteristik :
Open Frame
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Tin
Kontakte Fini Epesè - Post :
-
Kontakte Materyèl - Post :
Beryllium Copper
Materyèl Lojman :
Liquid Crystal Polymer (LCP)
Operating Tanperati :
-55°C ~ 125°C