Preci-Dip - 558-10-400M20-000104

KEY Part #: K3342528

558-10-400M20-000104 Pricing (USD) [731PC Stock]

  • 1 pcs$63.88012
  • 19 pcs$63.56231

Nimewo Pati:
558-10-400M20-000104
Manifakti:
Preci-Dip
Detaye deskripsyon:
BGA SURFACE MOUNT 1.27MM.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Konektè Fib optik - Kesyon, Modular Connectors - Jacks Avèk Magnetics, Blòk Tèminal - Blòk Baryè, Photovoltaic (Solar Panel) Connectors - Kontak, Tèminal blòk - Pwodwi pou Telefòn - Makè Ti bann, Kat Edge Connectors - adapters, Barik - Pwodwi pou Telefòn and FFC, FPC (Flat Fleksib) Connectors - Pwodwi pou Te ...
Avantaj konpetitif:
We specialize in Preci-Dip 558-10-400M20-000104 electronic components. 558-10-400M20-000104 can be shipped within 24 hours after order. If you have any demands for 558-10-400M20-000104, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

558-10-400M20-000104 Atribi pwodwi yo

Nimewo Pati : 558-10-400M20-000104
Manifakti : Preci-Dip
Deskripsyon : BGA SURFACE MOUNT 1.27MM
Seri : 558
Estati Pati : Active
Kalite : BGA
Nimewo nan pozisyon oswa Pins (gri) : 400 (20 x 20)
Pitch - kwazman : 0.050" (1.27mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 10.0µin (0.25µm)
Kontakte materyèl - kwazman : Brass
Mounting Kalite : Surface Mount
Karakteristik : Closed Frame
Revokasyon : Solder
Pitch - Post : 0.050" (1.27mm)
Kontakte Fini - Post : Gold
Kontakte Fini Epesè - Post : 10.0µin (0.25µm)
Kontakte Materyèl - Post : Brass
Materyèl Lojman : FR4 Epoxy Glass
Operating Tanperati : -55°C ~ 125°C
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