Manifakti :
Chip Quik Inc.
Deskripsyon :
MINI SOIC-10 EXP PAD TO DIP-10 S
Kalite Komisyon Konsèy Pwotokòl :
SMD to DIP
Pake a aksepte :
MiniSOIC EP
Goudwon :
0.020" (0.50mm)
Epesè Komisyon Konsèy la :
0.062" (1.57mm) 1/16"
Materyèl :
FR4 Epoxy Glass
Size / dimansyon :
0.700" x 0.500" (17.78mm x 12.70mm)