Xilinx Inc. - XCKU3P-2FFVA676E

KEY Part #: K1074109

[62PC Stock]


    Nimewo Pati:
    XCKU3P-2FFVA676E
    Manifakti:
    Xilinx Inc.
    Detaye deskripsyon:
    XCKU3P-2FFVA676E.
    Manufacturer's standard lead time:
    Nan stok
    Lavi etajè:
    Yon ane
    Chip Soti nan:
    Hong Kong
    RoHS:
    Metòd peman:
    Chemen chajman:
    Kategori Fanmi yo:
    KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Lojik - Rejis chanjman, Embedded - Microcontroleurs, Entèfas - switch analog, multiplexeurs, Demultiple, Clock / Distribisyon - Tanpon revèy, chofè yo, Embedded - FPGAs (Field Programmable Gate Array) a, Entèfas - Dirèk sentèz dijital (DDS), PMIC - Lighting, Ballast regulateur and Embedded - DSP (Digital Signal Processors) ...
    Avantaj konpetitif:
    We specialize in Xilinx Inc. XCKU3P-2FFVA676E electronic components. XCKU3P-2FFVA676E can be shipped within 24 hours after order. If you have any demands for XCKU3P-2FFVA676E, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    XCKU3P-2FFVA676E Atribi pwodwi yo

    Nimewo Pati : XCKU3P-2FFVA676E
    Manifakti : Xilinx Inc.
    Deskripsyon : XCKU3P-2FFVA676E
    Seri : Kintex® UltraScale+™
    Estati Pati : Active
    Kantite LABs / CLBs : 20340
    Nimewo nan eleman lojik / Selil yo : 355950
    Total Bits RAM : 31641600
    Kantite I / O : 256
    Nimewo nan Gates : -
    Voltage - Pwovizyon pou : 0.825V ~ 0.876V
    Mounting Kalite : Surface Mount
    Operating Tanperati : 0°C ~ 100°C (TJ)
    Pake / Ka : 676-BBGA, FCBGA
    Pake Aparèy Founisè : 676-FCBGA (27x27)