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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

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  1. Lakay
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  5. 530102B00150G

Aavid, Thermal Division of Boyd Corporation - 530102B00150G

KEY Part #: K6265527

530102B00150G Pricing (USD) [30167PC Stock]

  • 1 pcs$1.23837
  • 10 pcs$1.20576
  • 25 pcs$1.17297
  • 50 pcs$1.05102
  • 100 pcs$0.98922
  • 250 pcs$0.92740
  • 500 pcs$0.89648
  • 1,000 pcs$0.80374
  • 5,000 pcs$0.78828
Nimewo Pati:
530102B00150G
Manifakti:
Aavid, Thermal Division of Boyd Corporation
Detaye deskripsyon:
HEAT SINK 1.75 HIGH RISE TO-220. Heat Sinks High-Rise Style Board Level Stamped Heatsink with Wave-On Solderable Mounts for TO-220, Twisted Fins, Vertical Mounting, 6.3 n Thermal Resistance, Black Anodized, 4.75mm Hole, 18.29mm, Devi
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik - Pwodwi pou Telefòn, DC Fans, Tèmik - lavabo yo, Tèmik - adezif, epoksi, grès, kole, Tèmik - Pwodwi pou Telefòn, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Thermoelectric, Peltier Modules and Tèmik - adezif, epoksi, grès, kole ...
Avantaj konpetitif:
We specialize in Aavid, Thermal Division of Boyd Corporation 530102B00150G electronic components. 530102B00150G can be shipped within 24 hours after order. If you have any demands for 530102B00150G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

530102B00150G Atribi pwodwi yo

Nimewo Pati : 530102B00150G
Manifakti : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : HEAT SINK 1.75 HIGH RISE TO-220
Seri : -
Estati Pati : Active
Kalite : Board Level, Vertical
Pake refwadi : TO-220
Metòd Atachman : Clip and Board Mounts
Fòm : Square, Fins
Longè : 1.750" (44.45mm)
Lajè : 0.490" (12.44mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 1.750" (44.45mm)
Disipasyon pouvwa @ monte tanperati : 4.0W @ 30°C
Rezistans tèmik @ fòse Air koule : 1.50°C/W @ 400 LFM
Rezistans tèmik @ natirèl : 6.30°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Dènye nouvèl

Aavid, Thermal Division of Boyd Corporation Hi-Contact™ Liquid Cold Plates
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