HFA2.00CL100 Pricing (USD) [599PC Stock]
- 1 pcs$77.56320
- Nimewo Pati:
- HFA2.00CL100
- Manifakti:
- Techflex
- Detaye deskripsyon:
- TAPE HOT FUSION 1.97X 33.3YD.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Lakòl, adezif, aplikatè, Pwodwi pou Telefòn, Materyèl 2D, Distribitè Tape yo, Tep and Fim ...
- Avantaj konpetitif:
- We specialize in Techflex HFA2.00CL100 electronic components. HFA2.00CL100 can be shipped within 24 hours after order. If you have any demands for HFA2.00CL100, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
HFA2.00CL100 Atribi pwodwi yo
Nimewo Pati :
HFA2.00CL100
Manifakti :
Techflex
Deskripsyon :
TAPE HOT FUSION 1.97X 33.3YD
Seri :
Shrinkflex®
Estati Pati :
Active
Kalite Tep :
Hot Fusion
Adezif :
-
Fè bak, Carrier :
-
Pesè :
0.0120" (12.0 mils, 0.305mm)
Pesè - adezif :
-
Pesè - Fè bak, Carrier :
-
Lajè :
1.97" (50.00mm)
Longè :
100' (30.5m) 33.3 yds
Koulè :
Clear
Itilizasyon :
Sealing
Tanperati Range :
-
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