[12412PC Stock]
- Nimewo Pati:
- FI-XPB30SL-HF10
- Manifakti:
- JAE Electronics
- Detaye deskripsyon:
- CONN RCPT 30P 0.039 GOLD SMD R/A.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Keystone - Pwodwi pou Telefòn, Kat Edge Connectors - Kesyon, Modilè Konektè - ploge, Tèminal - Fil Pin Konektè, Keystone - Faceplates, kadr, Konektè rektangilè - Gratis Pandye, Mount Mount, Konèkteur Backplane - Pwodwi pou Telefòn and D-Sub Connectors ...
- Avantaj konpetitif:
- We specialize in JAE Electronics FI-XPB30SL-HF10 electronic components. FI-XPB30SL-HF10 can be shipped within 24 hours after order. If you have any demands for FI-XPB30SL-HF10, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
FI-XPB30SL-HF10 Atribi pwodwi yo
Nimewo Pati :
FI-XPB30SL-HF10
Manifakti :
JAE Electronics
Deskripsyon :
CONN RCPT 30P 0.039 GOLD SMD R/A
Seri :
FI-XP
Estati Pati :
Obsolete
Kalite Connector :
Receptacle
Kontakte Kalite :
Non-Gendered
Style :
Board to Cable/Wire
Kantite Pozisyon yo :
30
Kantite Pozisyon ki chaje :
All
Pitch - kwazman :
0.039" (1.00mm)
Kantite ranje yo :
1
Ranje espas - kwazman :
-
Mounting Kalite :
Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle
Revokasyon :
Solder
Kalite fiksasyon :
Friction Lock
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
12.0µin (0.30µm)
Koulè izolasyon :
Beige
Wotasyon izolasyon :
-
Longè Kontakte - Post :
-
Operating Tanperati :
-
Materyèl enflamabilite Rating :
UL94 V-0
Kontakte Fini - Post :
Tin
Konnen anpile Heights :
-
Pwoteksyon Antre :
-
Karakteristik :
Grounding Pins, Shielded, Solder Retention
Kouran Rating :
-
Rating Voltage :
-
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