Advanced Thermal Solutions Inc. - ATS-61270K-C1-R0

KEY Part #: K6263670

ATS-61270K-C1-R0 Pricing (USD) [7090PC Stock]

  • 1 pcs$5.20467
  • 10 pcs$4.95655
  • 25 pcs$4.64692
  • 50 pcs$4.49206
  • 100 pcs$4.12028
  • 250 pcs$3.87243
  • 500 pcs$3.79498
  • 1,000 pcs$3.77949

Nimewo Pati:
ATS-61270K-C1-R0
Manifakti:
Advanced Thermal Solutions Inc.
Detaye deskripsyon:
MAXIGRIP FANSINK 27X27X14.5MM. Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 26.25x26.25x14.5mm, 26.25mm dia.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - tiyo Chalè, Cham vapè, Tèmik - lavabo yo, Tèmik - Likid Refwadisman, Tèmik - Pwodwi pou Telefòn, Fanatik - Pwodwi pou Telefòn, Tèmik - adezif, epoksi, grès, kole, Tèmik - tèrmoelèktrik, asanble Peltier and DC Fans ...
Avantaj konpetitif:
We specialize in Advanced Thermal Solutions Inc. ATS-61270K-C1-R0 electronic components. ATS-61270K-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-61270K-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-61270K-C1-R0 Atribi pwodwi yo

Nimewo Pati : ATS-61270K-C1-R0
Manifakti : Advanced Thermal Solutions Inc.
Deskripsyon : MAXIGRIP FANSINK 27X27X14.5MM
Seri : fanSINK, maxiGRIP
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : BGA
Metòd Atachman : Clip, Thermal Material
Fòm : Square, Pin Fins
Longè : 1.063" (27.00mm)
Lajè : 1.063" (27.00mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.571" (14.50mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : 2.40°C/W @ 200 LFM
Rezistans tèmik @ natirèl : -
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Ou ka enterese tou
  • 512-12M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 182.88x304.8mm

  • 511-9U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x228.6mm

  • 511-9M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks H/S 5.21 X 9.00"

  • 511-6U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x152.4mm

  • 511-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 132.33x152.4mm

  • 511-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm