Nimewo Pati :
BDN16-3CB/A01
Manifakti :
CTS Thermal Management Products
Deskripsyon :
HEATSINK CPU W/ADHESIVE 1.61SQ
Pake refwadi :
Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman :
Thermal Tape, Adhesive (Included)
Wotè Off Sèvi (Tay nan Fin) :
0.355" (9.02mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
4.50°C/W @ 400 LFM
Rezistans tèmik @ natirèl :
13.50°C/W
Materyèl Fini :
Black Anodized