CTS Thermal Management Products - BDN16-3CB/A01

KEY Part #: K6264607

BDN16-3CB/A01 Pricing (USD) [19124PC Stock]

  • 1 pcs$1.99196
  • 10 pcs$1.94128
  • 25 pcs$1.88884
  • 50 pcs$1.78387
  • 100 pcs$1.67889
  • 250 pcs$1.57397
  • 500 pcs$1.52150
  • 1,000 pcs$1.36410

Nimewo Pati:
BDN16-3CB/A01
Manifakti:
CTS Thermal Management Products
Detaye deskripsyon:
HEATSINK CPU W/ADHESIVE 1.61SQ.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Thermoelectric, Peltier Modules, Tèmik - lavabo yo, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Pwodwi pou Telefòn, Tèmik - Likid Refwadisman, Fanatik - Pwodwi pou Telefòn, Tèmik - tèrmoelèktrik, asanble Peltier and Tèmik - adezif, epoksi, grès, kole ...
Avantaj konpetitif:
We specialize in CTS Thermal Management Products BDN16-3CB/A01 electronic components. BDN16-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN16-3CB/A01, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BDN16-3CB/A01 Atribi pwodwi yo

Nimewo Pati : BDN16-3CB/A01
Manifakti : CTS Thermal Management Products
Deskripsyon : HEATSINK CPU W/ADHESIVE 1.61SQ
Seri : BDN
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman : Thermal Tape, Adhesive (Included)
Fòm : Square, Pin Fins
Longè : 1.610" (40.89mm)
Lajè : 1.610" (40.89mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.355" (9.02mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : 4.50°C/W @ 400 LFM
Rezistans tèmik @ natirèl : 13.50°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized

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