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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 558-10-388M26-001101

Preci-Dip - 558-10-388M26-001101

KEY Part #: K3342556

558-10-388M26-001101 Pricing (USD) [800PC Stock]

  • 1 pcs$58.34767
  • 15 pcs$58.05738
Nimewo Pati:
558-10-388M26-001101
Manifakti:
Preci-Dip
Detaye deskripsyon:
PGA SOLDER TAIL 1.27MM.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Blòk Tèminal - Blòk Baryè, Modilè Konektè - ploge, Barik - Audio Connectors, Photovoltaic (Solè Panel) Connectors, Kalite Konnektè Power Connection - Housings, Tèminal Tèminal ak tourèl Boards, Kalite Konnektè pouvwa and Konektè devwa lou - Insérer, Modil yo ...
Avantaj konpetitif:
We specialize in Preci-Dip 558-10-388M26-001101 electronic components. 558-10-388M26-001101 can be shipped within 24 hours after order. If you have any demands for 558-10-388M26-001101, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

558-10-388M26-001101 Atribi pwodwi yo

Nimewo Pati : 558-10-388M26-001101
Manifakti : Preci-Dip
Deskripsyon : PGA SOLDER TAIL 1.27MM
Seri : 558
Estati Pati : Active
Kalite : PGA
Nimewo nan pozisyon oswa Pins (gri) : 388 (26 x 26)
Pitch - kwazman : 0.050" (1.27mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 10.0µin (0.25µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Closed Frame
Revokasyon : Solder
Pitch - Post : 0.050" (1.27mm)
Kontakte Fini - Post : Gold
Kontakte Fini Epesè - Post : 10.0µin (0.25µm)
Kontakte Materyèl - Post : Brass
Materyèl Lojman : FR4 Epoxy Glass
Operating Tanperati : -55°C ~ 125°C
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