A14557-02 Pricing (USD) [754PC Stock]
- 1 pcs$61.88111
- 3 pcs$61.57325
- Nimewo Pati:
- A14557-02
- Manifakti:
- Laird Technologies - Thermal Materials
- Detaye deskripsyon:
- THERM PAD 457.2MMX457.2MM BLUE. Thermal Interface Products Tflex 530 18x18" 2.8W/mK gap filler
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - tiyo Chalè, Cham vapè, Tèmik - Likid Refwadisman, Fanatik - Pwodwi pou Telefòn, Tèmik - Pwodwi pou Telefòn, Tèmik - lavabo yo, Tèmik - adezif, epoksi, grès, kole, Tèmik - tèrmoelèktrik, asanble Peltier and Tèmik - Kousinen, Dra ...
- Avantaj konpetitif:
- We specialize in Laird Technologies - Thermal Materials A14557-02 electronic components. A14557-02 can be shipped within 24 hours after order. If you have any demands for A14557-02, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A14557-02 Atribi pwodwi yo
Nimewo Pati :
A14557-02
Manifakti :
Laird Technologies - Thermal Materials
Deskripsyon :
THERM PAD 457.2MMX457.2MM BLUE
Seri :
Tflex™ 500
Estati Pati :
Not For New Designs
Itilizasyon :
-
Kalite :
Gap Filler Pad, Sheet
Fòm :
Square
Deskripsyon :
457.20mm x 457.20mm
Pesè :
0.0300" (0.762mm)
Materyèl :
Silicone Elastomer
Adezif :
Tacky - Both Sides
Fè bak, Carrier :
Fiberglass
Koulè :
Blue
Rezistivite tèmik :
-
Konductivite tèmik :
2.8 W/m-K
Dènye nouvèl
Ou ka enterese tou
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-22
Wakefield-Vette
THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Pati cho
- A16006-08
- A15896-15
- A15796-25
- GP3500ULM--0.100-12-0816
- GPHC3.0-0.125-02-0816
- A14571-01
- A15896-06
- A14950-15
- A15896-03
- GP3000S30-0.040-02-0816-NA
- A14558-01
- A14950-02
- PC93-20-20-4-1A
- A16487-14
- DC0038/02-PC99-0.06
- DC0040/08-PC99-0.06
- DC0041/01-PC99-0.06
- TG4040S-150-150-5.0-0
- TG4040S-320-320-3.0-0
- TG4040S-100-100-5.0-0
- TG4040S-320-320-2.0-0
- TG2030S-100-100-5.0-0
- DC0011/08-PC99-0.06
- DC0022/01-PC99-0.06
- PC93-20-10-0.25
- PC93-20-20-0.25
- PC99P-150-150-0.1-0
- PC99-300-300-0.12-0
- PC99-300-300-0.06-0
- A16364-07
- A15798-00
- A14162-15
- EYG-A060910P
- GPVOU-0.100-01-0816
- K4-06
- SPK10-0.006-00-36
- SPK10-0.006-00-48
- SPK10-0.006-00-22
- Q3-0.005-00-02
- Q3-0.005-00-36