Bergquist - GPHC3.0-0.100-02-0816

KEY Part #: K6153144

GPHC3.0-0.100-02-0816 Pricing (USD) [718PC Stock]

  • 1 pcs$64.98416
  • 4 pcs$64.66086

Nimewo Pati:
GPHC3.0-0.100-02-0816
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 406.4MMX203.2MM BLUE. Thermal Interface Products BERGQUIST GAP PAD TGP HC3000
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Pwodwi pou Telefòn, Tèmik - lavabo yo, Tèmik - Thermoelectric, Peltier Modules, Tèmik - adezif, epoksi, grès, kole, Tèmik - Likid Refwadisman, Tèmik - tiyo Chalè, Cham vapè, DC Fans and Tèmik - adezif, epoksi, grès, kole ...
Avantaj konpetitif:
We specialize in Bergquist GPHC3.0-0.100-02-0816 electronic components. GPHC3.0-0.100-02-0816 can be shipped within 24 hours after order. If you have any demands for GPHC3.0-0.100-02-0816, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

GPHC3.0-0.100-02-0816 Atribi pwodwi yo

Nimewo Pati : GPHC3.0-0.100-02-0816
Manifakti : Bergquist
Deskripsyon : THERM PAD 406.4MMX203.2MM BLUE
Seri : Gap Pad® HC 3.0
Estati Pati : Active
Itilizasyon : -
Kalite : Pad, Sheet
Fòm : Rectangular
Deskripsyon : 406.40mm x 203.20mm
Pesè : 0.100" (2.54mm)
Materyèl : -
Adezif : Tacky - Both Sides
Fè bak, Carrier : Fiberglass
Koulè : Blue
Rezistivite tèmik : -
Konductivite tèmik : 3.0 W/m-K

Ou ka enterese tou
  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole