Chip Quik Inc. - TS391SNL500C

KEY Part #: K6372225

Detaye deskripsyon:: THERMALLY STABLE SOLDER PASTE NO. Solder Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5

Kategori Fanmi yo:: KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Stentils soude, Modèl, Titilè, kanpe, Pwodwi pou Telefòn, Desoldering galon, mèch, ponp, Soude eponj, Tip Netwayan, Soude Irons, Pensèt, Manch, Distribitè, Distribitè Konsèy yo and Souding, Desoldering, Remanjeman Konsèy, bouch ...

Avantaj konpetitif:: We specialize in Chip Quik Inc. TS391SNL500C electronic components. TS391SNL500C can be shipped within 24 hours after order. If you have any demands for TS391SNL500C, Please submit a Request for Quotation here or send us an email: rfq@key-components.com

Nimewo Pati : TS391SNL500C

Manifakti : Chip Quik Inc.

Deskripsyon : THERMALLY STABLE SOLDER PASTE NO

Seri : -

Estati Pati : Active

Kalite : Solder Paste

Konpozisyon : Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Dyamèt : -

Pwen fizyon : 423 ~ 428°F (217 ~ 220°C)

Kalite Flux : No-Clean

Fil Kalib : -

Pwosesis : Lead Free

Fòm : Cartridge, 17.64 oz (500g)

Lavi etajè : 12 Months

Lavi etajè kòmanse : Date of Manufacture

Tanperati Depo / Refrijerasyon : 68°F ~ 77°F (20°C ~ 25°C)

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