A14568-01 Pricing (USD) [802PC Stock]
- 1 pcs$58.18719
- 4 pcs$57.89770
- Nimewo Pati:
- A14568-01
- Manifakti:
- Laird Technologies - Thermal Materials
- Detaye deskripsyon:
- THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products Tflex 5140 9x9" 2.8W/mK gap filler
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - adezif, epoksi, grès, kole, Tèmik - Thermoelectric, Peltier Modules, Tèmik - Kousinen, Dra, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Pwodwi pou Telefòn, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Likid Refwadisman and Fanatik - Pwodwi pou Telefòn ...
- Avantaj konpetitif:
- We specialize in Laird Technologies - Thermal Materials A14568-01 electronic components. A14568-01 can be shipped within 24 hours after order. If you have any demands for A14568-01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A14568-01 Atribi pwodwi yo
Nimewo Pati :
A14568-01
Manifakti :
Laird Technologies - Thermal Materials
Deskripsyon :
THERM PAD 228.6MMX228.6MM BLUE
Seri :
Tflex™ 500
Estati Pati :
Not For New Designs
Itilizasyon :
-
Kalite :
Gap Filler Pad, Sheet
Fòm :
Square
Deskripsyon :
228.60mm x 228.60mm
Pesè :
0.140" (3.56mm)
Materyèl :
Silicone Elastomer
Adezif :
Tacky - Both Sides
Fè bak, Carrier :
-
Koulè :
Blue
Rezistivite tèmik :
-
Konductivite tèmik :
2.8 W/m-K
Dènye nouvèl
Ou ka enterese tou
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Pati cho
- A15796-22
- A15896-19
- A15996-12
- A15996-10
- A14570-01
- A14569-03
- A14950-11
- A14557-01
- SP400-0.009-00-1212
- T69-305-305-0.017-1A
- 5519S-1MIL
- DC0040/11-PC99AL-0.1
- DC0040/07-PC99AL-0.1
- DC0040/03-PC99AL-0.1
- DC0040/10-PC99-0.06
- DC0036/01-PC99AL-0.1
- DC0036/03-PC99-0.06
- DC0036/02-PC99AL-0.1
- DC0039/01-PC99AL-0.1
- DC0039/03-PC99-0.06
- DC0038/06-PC99AL-0.1
- DC0038/05-PC99-0.06
- TG2030S-320-320-3.0-0
- TG4040S-300-300-2.0-0
- PC93-100-100-0.25-0
- PC93-300-300-0.25-0
- TGX-2-320-320-1.5
- TGX-2-150-150-1.5
- DC0022/03-PC99-0.06
- PC93-10-5-0.25
- PC93-10-10-0.25
- PC94-320-320-0.25-0
- PC99-150-150-0.06-0
- A15673-12
- A16365-13
- A10197-03
- A14162-32
- TW12
- EYG-A121810B
- TG6050-20-20-1.0