558-10-356M26-001104 Pricing (USD) [820PC Stock]
- 1 pcs$56.85327
- 15 pcs$56.57042
- Nimewo Pati:
- 558-10-356M26-001104
- Manifakti:
- Preci-Dip
- Detaye deskripsyon:
- BGA SURFACE MOUNT 1.27MM.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Photovoltaic (Solar Panel) Connectors - Pwodwi pou, Kowaksyal Connector (RF) - Cartes, Bannann ak Ide Konektè - adaptè, Tèminal blòk - Pwodwi pou Telefòn - Fil fè, Tèminal - Konektè tourèl, Kalite Connectors Pouvwa Kalite - Pwodwi pou Telef, D-Sub, D-an fòm Konnektè - Housings and Konnektè memwa - Kat PC Sockets ...
- Avantaj konpetitif:
- We specialize in Preci-Dip 558-10-356M26-001104 electronic components. 558-10-356M26-001104 can be shipped within 24 hours after order. If you have any demands for 558-10-356M26-001104, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
558-10-356M26-001104 Atribi pwodwi yo
Nimewo Pati :
558-10-356M26-001104
Manifakti :
Preci-Dip
Deskripsyon :
BGA SURFACE MOUNT 1.27MM
Seri :
558
Estati Pati :
Active
Kalite :
BGA
Nimewo nan pozisyon oswa Pins (gri) :
356 (26 x 26)
Pitch - kwazman :
0.050" (1.27mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
10.0µin (0.25µm)
Kontakte materyèl - kwazman :
Brass
Mounting Kalite :
Surface Mount
Karakteristik :
Closed Frame
Revokasyon :
Solder
Pitch - Post :
0.050" (1.27mm)
Kontakte Fini - Post :
Gold
Kontakte Fini Epesè - Post :
10.0µin (0.25µm)
Kontakte Materyèl - Post :
Brass
Materyèl Lojman :
FR4 Epoxy Glass
Operating Tanperati :
-55°C ~ 125°C
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