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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 40-6556-10

Aries Electronics - 40-6556-10

KEY Part #: K3356603

40-6556-10 Pricing (USD) [8395PC Stock]

  • 1 pcs$4.93394
  • 9 pcs$4.90940
Nimewo Pati:
40-6556-10
Manifakti:
Aries Electronics
Detaye deskripsyon:
CONN IC DIP SOCKET 40POS GOLD. IC & Component Sockets 40 SCKT RECEPT TIN SOLDER TAIL
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Terminals - Screw Connectors, Konèkteur Backplane - Housings, Kontak, Prentan chaje ak chaje, Kat Edge Connectors - Pwodwi pou Telefòn, Konektè devwa lou - kadr, Kalite Konnektè pouvwa, Blòk Tèminal - Blòk Baryè and Konektè Fib optik - Cartes ...
Avantaj konpetitif:
We specialize in Aries Electronics 40-6556-10 electronic components. 40-6556-10 can be shipped within 24 hours after order. If you have any demands for 40-6556-10, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

40-6556-10 Atribi pwodwi yo

Nimewo Pati : 40-6556-10
Manifakti : Aries Electronics
Deskripsyon : CONN IC DIP SOCKET 40POS GOLD
Seri : 6556
Estati Pati : Active
Kalite : DIP, 0.6" (15.24mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) : 40 (2 x 20)
Pitch - kwazman : 0.100" (2.54mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 30.0µin (0.76µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Open Frame
Revokasyon : Solder
Pitch - Post : 0.100" (2.54mm)
Kontakte Fini - Post : Tin
Kontakte Fini Epesè - Post : 200.0µin (5.08µm)
Kontakte Materyèl - Post : Brass
Materyèl Lojman : Polyphenylene Sulfide (PPS), Glass Filled
Operating Tanperati : -
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