Nimewo Pati :
APR33-33-12CB/M
Manifakti :
CTS Thermal Management Products
Deskripsyon :
HEATSINK FORGED WITH MEDIUM CLIP
Pake refwadi :
Assorted (BGA, LGA, CPU, ASIC...)
Wotè Off Sèvi (Tay nan Fin) :
0.457" (11.60mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
3.80°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
-
Materyèl Fini :
Black Anodized