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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. SP900S-0.009-AC-58

Bergquist - SP900S-0.009-AC-58

KEY Part #: K6151079

SP900S-0.009-AC-58 Pricing (USD) [406614PC Stock]

  • 1 pcs$0.09096
  • 10 pcs$0.08266
  • 50 pcs$0.07404
  • 100 pcs$0.06549
  • 500 pcs$0.05695
  • 1,000 pcs$0.04271
  • 5,000 pcs$0.03702
Nimewo Pati:
SP900S-0.009-AC-58
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 19.05MMX12.7MM W/ADH. Thermal Interface Products High Performance Insulator for Low-Pressure Applications, 0.009" Thickness, Adhesive - One Side, 19.05x12.70x4.75x3.73mm, Sil-Pad TSP 1600S Series / Also Known as Bergq
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - Thermoelectric, Peltier Modules, Tèmik - tèrmoelèktrik, asanble Peltier, DC Fans, Fanatik - Pwodwi pou Telefòn, Tèmik - adezif, epoksi, grès, kole, Tèmik - Likid Refwadisman and Tèmik - lavabo yo ...
Avantaj konpetitif:
We specialize in Bergquist SP900S-0.009-AC-58 electronic components. SP900S-0.009-AC-58 can be shipped within 24 hours after order. If you have any demands for SP900S-0.009-AC-58, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

SP900S-0.009-AC-58 Atribi pwodwi yo

Nimewo Pati : SP900S-0.009-AC-58
Manifakti : Bergquist
Deskripsyon : THERM PAD 19.05MMX12.7MM W/ADH
Seri : Sil-Pad® 900-S
Estati Pati : Active
Itilizasyon : TO-220
Kalite : Pad, Sheet
Fòm : Rectangular
Deskripsyon : 19.05mm x 12.70mm
Pesè : 0.0090" (0.229mm)
Materyèl : Silicone Rubber
Adezif : Adhesive - One Side
Fè bak, Carrier : Fiberglass
Koulè : Pink
Rezistivite tèmik : 0.61°C/W
Konductivite tèmik : 1.6 W/m-K

Dènye nouvèl

Bergquist Company GAP PAD HC 5.0 Thermal Interface
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