3M - 228-7396-55-1902

KEY Part #: K3344512

228-7396-55-1902 Pricing (USD) [2337PC Stock]

  • 1 pcs$17.64710
  • 10 pcs$15.93057
  • 25 pcs$15.26296
  • 50 pcs$14.30902
  • 100 pcs$13.83205
  • 250 pcs$13.06891

Nimewo Pati:
228-7396-55-1902
Manifakti:
3M
Detaye deskripsyon:
CONN SOCKET SOIC 28POS GOLD. IC & Component Sockets BURN-IN SOIC SOCKET 28 Leads
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Ant adaptè seri yo, Tèminal blòk - Modil Entèfas, Bannann ak Tip Connectors - Pwodwi pou Telefòn, Konektè rektangilè - Arrays, Kalite Edge, mezzanin, Konektè devwa lou - kadr, Konnektè Konnen, Kat Edge Connectors - adapters and Terminals - Screw Connectors ...
Avantaj konpetitif:
We specialize in 3M 228-7396-55-1902 electronic components. 228-7396-55-1902 can be shipped within 24 hours after order. If you have any demands for 228-7396-55-1902, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

228-7396-55-1902 Atribi pwodwi yo

Nimewo Pati : 228-7396-55-1902
Manifakti : 3M
Deskripsyon : CONN SOCKET SOIC 28POS GOLD
Seri : Textool™
Estati Pati : Active
Kalite : SOIC
Nimewo nan pozisyon oswa Pins (gri) : 28 (2 x 14)
Pitch - kwazman : -
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : -
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Closed Frame
Revokasyon : Solder
Pitch - Post : -
Kontakte Fini - Post : Gold
Kontakte Fini Epesè - Post : 30.0µin (0.76µm)
Kontakte Materyèl - Post : Beryllium Copper
Materyèl Lojman : Polyethersulfone (PES), Glass Filled
Operating Tanperati : -55°C ~ 150°C

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