ATS-51330K-C1-R0 Pricing (USD) [7193PC Stock]
- 1 pcs$4.86533
- 10 pcs$4.59298
- 25 pcs$4.32291
- 50 pcs$4.05268
- 100 pcs$3.78253
- 250 pcs$3.51234
- 500 pcs$3.44479
- 1,000 pcs$3.37725
- Nimewo Pati:
- ATS-51330K-C1-R0
- Manifakti:
- Advanced Thermal Solutions Inc.
- Detaye deskripsyon:
- HEAT SINK 33MM X 33MM X 14.5MM. Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 33x33x14.5mm, 58.2mm Fin Tip
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - adezif, epoksi, grès, kole, Tèmik - Likid Refwadisman, Tèmik - Thermoelectric, Peltier Modules, Tèmik - lavabo yo, DC Fans, Tèmik - Pwodwi pou Telefòn, Tèmik - tèrmoelèktrik, asanble Peltier and Tèmik - Kousinen, Dra ...
- Avantaj konpetitif:
- We specialize in Advanced Thermal Solutions Inc. ATS-51330K-C1-R0 electronic components. ATS-51330K-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-51330K-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-51330K-C1-R0 Atribi pwodwi yo
Nimewo Pati :
ATS-51330K-C1-R0
Manifakti :
Advanced Thermal Solutions Inc.
Deskripsyon :
HEAT SINK 33MM X 33MM X 14.5MM
Seri :
maxiGRIP, maxiFLOW
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
BGA
Metòd Atachman :
Clip, Thermal Material
Fòm :
Square, Angled Fins
Longè :
1.299" (32.99mm)
Lajè :
1.299" (32.99mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.571" (14.50mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
3.40°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
-
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
Dènye nouvèl
Ou ka enterese tou
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
396-1AB
Wakefield-Vette
HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes
-
392-300AB
Wakefield-Vette
HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm
-
Pati cho
- FEX827269T710
- 109X9212PT0H016
- 565020-01
- FEX35-35-21/T710/M2
- RUR6712U
- 9-1542003-4
- 5-1542003-1
- 1542003-9
- 5-1542000-5
- 821002B04000
- 821502B00000
- 825600T00000
- TC014-06001
- MHST10055
- MHSL05040
- MHSL02525
- 528-45AB-MS4
- TXBF032025B
- 625-25ABT4
- 657-20ABP
- 288-1AB
- LA363B5CB
- LA363B4CB
- PSC2-1CB
- PA2-7CB
- PA2-1CB
- 7-323-BA
- 7-300-000-BA
- 1-1963563-4
- 2-1963558-2
- 2-1963564-5
- 2-1963560-3
- 1-1963553-5
- 2-1963551-3
- 1-1963553-3
- 39880100130
- 39880100050
- 39880100070
- LAT0127B3CB
- UP1-TO3B