Advanced Thermal Solutions Inc. - ATS-51330K-C1-R0

KEY Part #: K6263855

ATS-51330K-C1-R0 Pricing (USD) [7193PC Stock]

  • 1 pcs$4.86533
  • 10 pcs$4.59298
  • 25 pcs$4.32291
  • 50 pcs$4.05268
  • 100 pcs$3.78253
  • 250 pcs$3.51234
  • 500 pcs$3.44479
  • 1,000 pcs$3.37725

Nimewo Pati:
ATS-51330K-C1-R0
Manifakti:
Advanced Thermal Solutions Inc.
Detaye deskripsyon:
HEAT SINK 33MM X 33MM X 14.5MM. Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 33x33x14.5mm, 58.2mm Fin Tip
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - lavabo yo, Tèmik - adezif, epoksi, grès, kole, Tèmik - Pwodwi pou Telefòn, Fanatik - Pwodwi pou Telefòn, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - tiyo Chalè, Cham vapè, Fanatik AC and Tèmik - Likid Refwadisman ...
Avantaj konpetitif:
We specialize in Advanced Thermal Solutions Inc. ATS-51330K-C1-R0 electronic components. ATS-51330K-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-51330K-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-51330K-C1-R0 Atribi pwodwi yo

Nimewo Pati : ATS-51330K-C1-R0
Manifakti : Advanced Thermal Solutions Inc.
Deskripsyon : HEAT SINK 33MM X 33MM X 14.5MM
Seri : maxiGRIP, maxiFLOW
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : BGA
Metòd Atachman : Clip, Thermal Material
Fòm : Square, Angled Fins
Longè : 1.299" (32.99mm)
Lajè : 1.299" (32.99mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.571" (14.50mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : 3.40°C/W @ 200 LFM
Rezistans tèmik @ natirèl : -
Materyèl : Aluminum
Materyèl Fini : Black Anodized

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