Laird Technologies - Thermal Materials - A14950-14

KEY Part #: K6153162

A14950-14 Pricing (USD) [793PC Stock]

  • 1 pcs$58.81929
  • 4 pcs$58.52665

Nimewo Pati:
A14950-14
Manifakti:
Laird Technologies - Thermal Materials
Detaye deskripsyon:
THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products Tflex 5140 DC1 9x9" 2.8W/mK gap filler
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - tiyo Chalè, Cham vapè, Fanatik - Pwodwi pou Telefòn, Tèmik - Kousinen, Dra, Tèmik - Likid Refwadisman, Tèmik - Thermoelectric, Peltier Modules, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - Pwodwi pou Telefòn and Fanatik AC ...
Avantaj konpetitif:
We specialize in Laird Technologies - Thermal Materials A14950-14 electronic components. A14950-14 can be shipped within 24 hours after order. If you have any demands for A14950-14, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A14950-14 Atribi pwodwi yo

Nimewo Pati : A14950-14
Manifakti : Laird Technologies - Thermal Materials
Deskripsyon : THERM PAD 228.6MMX228.6MM BLUE
Seri : Tflex™ 500
Estati Pati : Not For New Designs
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Square
Deskripsyon : 228.60mm x 228.60mm
Pesè : 0.140" (3.56mm)
Materyèl : Silicone Elastomer
Adezif : Tacky - One Side
Fè bak, Carrier : -
Koulè : Blue
Rezistivite tèmik : -
Konductivite tèmik : 2.8 W/m-K

Ou ka enterese tou
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole