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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. 501403B00000G

Aavid, Thermal Division of Boyd Corporation - 501403B00000G

KEY Part #: K6265366

501403B00000G Pricing (USD) [76655PC Stock]

  • 1 pcs$0.48918
  • 10 pcs$0.46660
  • 25 pcs$0.45439
  • 50 pcs$0.44210
  • 100 pcs$0.41751
  • 250 pcs$0.39296
  • 500 pcs$0.34849
  • 1,000 pcs$0.32526
  • 5,000 pcs$0.31364
Nimewo Pati:
501403B00000G
Manifakti:
Aavid, Thermal Division of Boyd Corporation
Detaye deskripsyon:
HEAT SINK TO-3 .750 COMPACT. Heat Sinks Diamond Shaped Basket Stamped Heatsink for TO-3, Low-Cost, Horizontal Mounting, 10 n Thermal Resistance, Black Anodized, 19.05mm
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: DC Fans, Fanatik - Pwodwi pou Telefòn, Tèmik - Kousinen, Dra, Tèmik - tiyo Chalè, Cham vapè, Tèmik - adezif, epoksi, grès, kole, Tèmik - Likid Refwadisman, Fanatik AC and Tèmik - adezif, epoksi, grès, kole ...
Avantaj konpetitif:
We specialize in Aavid, Thermal Division of Boyd Corporation 501403B00000G electronic components. 501403B00000G can be shipped within 24 hours after order. If you have any demands for 501403B00000G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

501403B00000G Atribi pwodwi yo

Nimewo Pati : 501403B00000G
Manifakti : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : HEAT SINK TO-3 .750 COMPACT
Seri : -
Estati Pati : Active
Kalite : Board Level
Pake refwadi : TO-3
Metòd Atachman : Bolt On
Fòm : Rhombus
Longè : 1.880" (47.75mm)
Lajè : 1.400" (35.56mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.750" (19.05mm)
Disipasyon pouvwa @ monte tanperati : 4.0W @ 40°C
Rezistans tèmik @ fòse Air koule : 3.00°C/W @ 400 LFM
Rezistans tèmik @ natirèl : 10.00°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Dènye nouvèl

Aavid, Thermal Division of Boyd Corporation Hi-Contact™ Liquid Cold Plates
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