Xilinx Inc. - XC3SD3400A-5FGG676C

KEY Part #: K1077673

XC3SD3400A-5FGG676C Pricing (USD) [761PC Stock]

  • 1 pcs$68.20714
  • 40 pcs$67.86780

Nimewo Pati:
XC3SD3400A-5FGG676C
Manifakti:
Xilinx Inc.
Detaye deskripsyon:
IC FPGA 469 I/O 676FBGA.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Entèfas - Entèfas sensor ak detektè, Lineyè - Videyo Processing, Embedded - CPLDs (Aparèy lojik Pwogramè konplèks), Lojik - Gates ak Inverters - Multi-Fonksyon, confi, PMIC - konplè, demi-pon chofè, Akizisyon Done - Analog Front End (AFE), Embedded - Microcontroleurs - Aplikasyon espesifik and Lojik - Fonksyon Otobis Inivèsèl yo ...
Avantaj konpetitif:
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GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

XC3SD3400A-5FGG676C Atribi pwodwi yo

Nimewo Pati : XC3SD3400A-5FGG676C
Manifakti : Xilinx Inc.
Deskripsyon : IC FPGA 469 I/O 676FBGA
Seri : Spartan®-3A DSP
Estati Pati : Active
Kantite LABs / CLBs : 5968
Nimewo nan eleman lojik / Selil yo : 53712
Total Bits RAM : 2322432
Kantite I / O : 469
Nimewo nan Gates : 3400000
Voltage - Pwovizyon pou : 1.14V ~ 1.26V
Mounting Kalite : Surface Mount
Operating Tanperati : 0°C ~ 85°C (TJ)
Pake / Ka : 676-BGA
Pake Aparèy Founisè : 676-FBGA (27x27)