Nimewo Pati :
ATS-13F-31-C2-R0
Manifakti :
Advanced Thermal Solutions Inc.
Deskripsyon :
HEATSINK 57.9X36.83X5.84MM T766
Pake refwadi :
Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman :
Push Pin
Wotè Off Sèvi (Tay nan Fin) :
0.230" (5.84mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
25.25°C/W @ 100 LFM
Rezistans tèmik @ natirèl :
-
Materyèl Fini :
Blue Anodized