Manifakti :
Chip Quik Inc.
Deskripsyon :
ALUMINUM SOLDER PASTE WATER-SOLU
Konpozisyon :
Sn96.5Ag3.5 (96.5/3.5)
Pwen fizyon :
430°F (221°C)
Kalite Flux :
Water Soluble
Fòm :
Syringe, 0.88 oz (25g), 10cc
Lavi etajè :
12 Months, 6 Months
Lavi etajè kòmanse :
Date of Manufacture
Tanperati Depo / Refrijerasyon :
37°F ~ 46°F (3°C ~ 8°C)