Laird Technologies EMI - 67SLG050050030PI00

KEY Part #: K7281542

67SLG050050030PI00 Pricing (USD) [586745PC Stock]

  • 1 pcs$0.06304
  • 1,500 pcs$0.05731
  • 3,000 pcs$0.05253
  • 7,500 pcs$0.04935
  • 10,500 pcs$0.04616
  • 37,500 pcs$0.04235
  • 75,000 pcs$0.04075

Nimewo Pati:
67SLG050050030PI00
Manifakti:
Laird Technologies EMI
Detaye deskripsyon:
METAL FILM OVER FOAM CONTACTS.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Antenne RFID, RF transmisèteur ICs, RF modilatè, RF Antèn, RF pouvwa divizeur / Splitters, RFI ak EMI - Kontak, Fingerstock ak jwen, RF Demodulators and Evalyasyon RFID ak twous Devlopman, Boards ...
Avantaj konpetitif:
We specialize in Laird Technologies EMI 67SLG050050030PI00 electronic components. 67SLG050050030PI00 can be shipped within 24 hours after order. If you have any demands for 67SLG050050030PI00, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

67SLG050050030PI00 Atribi pwodwi yo

Nimewo Pati : 67SLG050050030PI00
Manifakti : Laird Technologies EMI
Deskripsyon : METAL FILM OVER FOAM CONTACTS
Seri : SMD Grounding Metallized
Estati Pati : Active
Kalite : Film Over Foam
Fòm : Rectangle
Lajè : 0.197" (5.00mm)
Longè : 0.118" (3.00mm)
Wotè : 0.197" (5.00mm)
Materyèl : Polyurethane Foam, Tin-Copper Polyester (SN/CU)
PLATING : -
PLATING - Epesè : -
Metòd Atachman : Solder
Operating Tanperati : -40°C ~ 70°C