Advanced Thermal Solutions Inc. - ATS-51300K-C1-R0

KEY Part #: K6263891

ATS-51300K-C1-R0 Pricing (USD) [7357PC Stock]

  • 1 pcs$4.88296
  • 10 pcs$4.75119
  • 25 pcs$4.48721
  • 50 pcs$4.22314
  • 100 pcs$3.95925
  • 250 pcs$3.69529
  • 500 pcs$3.43133
  • 1,000 pcs$3.36534

Nimewo Pati:
ATS-51300K-C1-R0
Manifakti:
Advanced Thermal Solutions Inc.
Detaye deskripsyon:
HEAT SINK 30MM X 30MM X 14.5MM. Heat Sinks maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 30x30x14.5mm, 53.3mm Fin Tip
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Likid Refwadisman, DC Fans, Tèmik - adezif, epoksi, grès, kole, Tèmik - tèrmoelèktrik, asanble Peltier, Fanatik - Pwodwi pou Telefòn - Fil Fan, Fanatik - Pwodwi pou Telefòn, Tèmik - Pwodwi pou Telefòn and Tèmik - Kousinen, Dra ...
Avantaj konpetitif:
We specialize in Advanced Thermal Solutions Inc. ATS-51300K-C1-R0 electronic components. ATS-51300K-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-51300K-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-51300K-C1-R0 Atribi pwodwi yo

Nimewo Pati : ATS-51300K-C1-R0
Manifakti : Advanced Thermal Solutions Inc.
Deskripsyon : HEAT SINK 30MM X 30MM X 14.5MM
Seri : maxiGRIP, maxiFLOW
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : BGA
Metòd Atachman : Clip, Thermal Material
Fòm : Square, Angled Fins
Longè : 1.181" (30.00mm)
Lajè : 1.181" (30.00mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.571" (14.50mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : 4.30°C/W @ 200 LFM
Rezistans tèmik @ natirèl : -
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Ou ka enterese tou
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 511-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm

  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 396-1AB

    Wakefield-Vette

    HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.