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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 558-10-357M19-001104

Preci-Dip - 558-10-357M19-001104

KEY Part #: K3342570

558-10-357M19-001104 Pricing (USD) [819PC Stock]

  • 1 pcs$57.01298
  • 21 pcs$56.72934
Nimewo Pati:
558-10-357M19-001104
Manifakti:
Preci-Dip
Detaye deskripsyon:
BGA SURFACE MOUNT 1.27MM.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Modilè Konektè - ploge, Konektè rektangilè - Tèt, Pin spesyalite, Konèkteur Backplane - Housings, Tèminal blòk - Tèt, ploge ak Sockets, Modilè Konektè - Pwodwi pou Telefòn, Kowaksyal Connector (RF) - Cartes, Tèminal blòk - Pwodwi pou Telefòn and Terminals - Spade Connectors ...
Avantaj konpetitif:
We specialize in Preci-Dip 558-10-357M19-001104 electronic components. 558-10-357M19-001104 can be shipped within 24 hours after order. If you have any demands for 558-10-357M19-001104, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

558-10-357M19-001104 Atribi pwodwi yo

Nimewo Pati : 558-10-357M19-001104
Manifakti : Preci-Dip
Deskripsyon : BGA SURFACE MOUNT 1.27MM
Seri : 558
Estati Pati : Active
Kalite : BGA
Nimewo nan pozisyon oswa Pins (gri) : 357 (19 x 19)
Pitch - kwazman : 0.050" (1.27mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 10.0µin (0.25µm)
Kontakte materyèl - kwazman : Brass
Mounting Kalite : Surface Mount
Karakteristik : Closed Frame
Revokasyon : Solder
Pitch - Post : 0.050" (1.27mm)
Kontakte Fini - Post : Gold
Kontakte Fini Epesè - Post : 10.0µin (0.25µm)
Kontakte Materyèl - Post : Brass
Materyèl Lojman : FR4 Epoxy Glass
Operating Tanperati : -55°C ~ 125°C
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