Nimewo Pati :
B39202B9908P810
Manifakti :
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Aplikasyon :
Cellular, SCDMA
Mounting Kalite :
Surface Mount
Pake / Ka :
10-SMD, No Lead
Wotè (Max) :
0.018" (0.45mm)
Size / dimansyon :
0.059" L x 0.043" W (1.50mm x 1.10mm)