BDN09-3CB Pricing (USD) [48708PC Stock]
- 1 pcs$0.71077
- 10 pcs$0.67523
- 25 pcs$0.65742
- 50 pcs$0.63969
- 100 pcs$0.60415
- 250 pcs$0.56862
- 500 pcs$0.53308
- 1,000 pcs$0.49754
- 5,000 pcs$0.47977
- Nimewo Pati:
- BDN09-3CB
- Manifakti:
- CTS Thermal Management Products
- Detaye deskripsyon:
- HEATSINK CPU .91 SQ.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik AC, Tèmik - adezif, epoksi, grès, kole, DC Fans, Tèmik - Thermoelectric, Peltier Modules, Tèmik - tiyo Chalè, Cham vapè, Tèmik - adezif, epoksi, grès, kole, Fanatik - Pwodwi pou Telefòn - Fil Fan and Tèmik - lavabo yo ...
- Avantaj konpetitif:
- We specialize in CTS Thermal Management Products BDN09-3CB electronic components. BDN09-3CB can be shipped within 24 hours after order. If you have any demands for BDN09-3CB, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BDN09-3CB Atribi pwodwi yo
Nimewo Pati :
BDN09-3CB
Manifakti :
CTS Thermal Management Products
Deskripsyon :
HEATSINK CPU .91 SQ
Seri :
BDN
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman :
Thermal Tape, Adhesive (Not Included)
Fòm :
Square, Pin Fins
Longè :
0.910" (23.11mm)
Lajè :
0.910" (23.11mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.355" (9.02mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
9.60°C/W @ 400 LFM
Rezistans tèmik @ natirèl :
26.90°C/W
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
Dènye nouvèl
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902-21-2-12-2-B-0
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HEATSINK 21X21X12MM PIN. Heat Sinks Chipset Heatsink with Clip, Pin Fin, 21mm Chip Size, 11.6mm Height, Aluminum, Black Anodized
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667-10ABPPE
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HEATSINK TO-220 W/PINS. Heat Sinks Labor-Saving SpeedClip Heatsink for Vertical Board Mounting for TO-220, Plain Pin, 25.4mm Height
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