ATS-X53330G-C1-R0 Pricing (USD) [5259PC Stock]
- 1 pcs$7.76513
- 10 pcs$7.33237
- 25 pcs$6.90101
- 50 pcs$6.46965
- 100 pcs$6.03834
- 250 pcs$5.60701
- 500 pcs$5.49919
- Nimewo Pati:
- ATS-X53330G-C1-R0
- Manifakti:
- Advanced Thermal Solutions Inc.
- Detaye deskripsyon:
- SUPERGRIP HEATSINK 33X33X12.5MM. Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 33x33x12.5mm
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Pwodwi pou Telefòn, Tèmik - tèrmoelèktrik, asanble Peltier, Fanatik AC, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - Kousinen, Dra, Tèmik - Thermoelectric, Peltier Modules, Tèmik - adezif, epoksi, grès, kole and Tèmik - Likid Refwadisman ...
- Avantaj konpetitif:
- We specialize in Advanced Thermal Solutions Inc. ATS-X53330G-C1-R0 electronic components. ATS-X53330G-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-X53330G-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-X53330G-C1-R0 Atribi pwodwi yo
Nimewo Pati :
ATS-X53330G-C1-R0
Manifakti :
Advanced Thermal Solutions Inc.
Deskripsyon :
SUPERGRIP HEATSINK 33X33X12.5MM
Seri :
superGRIP™
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
BGA
Metòd Atachman :
Clip, Thermal Material
Fòm :
Square, Fins
Longè :
1.299" (32.99mm)
Lajè :
1.299" (32.99mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.492" (12.50mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
5.80°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
-
Materyèl :
Aluminum
Materyèl Fini :
Blue Anodized
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