Nimewo Pati :
RASWLF.031 4OZ
Manifakti :
Chip Quik Inc.
Deskripsyon :
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Konpozisyon :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Pwen fizyon :
422 ~ 428°F (217 ~ 220°C)
Kalite Flux :
Rosin Activated (RA)
Fil Kalib :
21 AWG, 20 SWG
Fòm :
Spool, 4 oz (113.40g)
Tanperati Depo / Refrijerasyon :
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