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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 28-3574-18

Aries Electronics - 28-3574-18

KEY Part #: K3342814

28-3574-18 Pricing (USD) [1158PC Stock]

  • 1 pcs$37.55790
  • 11 pcs$37.37104
Nimewo Pati:
28-3574-18
Manifakti:
Aries Electronics
Detaye deskripsyon:
CONN IC DIP SOCKET ZIF 28POS GLD. IC & Component Sockets QUICK RELEASE 28 PIN HI TEMP
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Kowaksyal Connector (RF) - Terminators, Konèkteur Backplane - Hard metrik, Creole, Konèkteur Backplane - DIN 41612, Terminals - Pwodwi pou Telefòn, Konektè LGH, Konektè rektangilè - Tèt, Pin spesyalite, D-ki gen fòm Connectors - Centronics and Konèkteur Backplane - ARINC ...
Avantaj konpetitif:
We specialize in Aries Electronics 28-3574-18 electronic components. 28-3574-18 can be shipped within 24 hours after order. If you have any demands for 28-3574-18, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

28-3574-18 Atribi pwodwi yo

Nimewo Pati : 28-3574-18
Manifakti : Aries Electronics
Deskripsyon : CONN IC DIP SOCKET ZIF 28POS GLD
Seri : 57
Estati Pati : Active
Kalite : DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) : 28 (2 x 14)
Pitch - kwazman : 0.100" (2.54mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 10.0µin (0.25µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Closed Frame
Revokasyon : Solder
Pitch - Post : 0.100" (2.54mm)
Kontakte Fini - Post : Gold
Kontakte Fini Epesè - Post : 10.0µin (0.25µm)
Kontakte Materyèl - Post : Beryllium Copper
Materyèl Lojman : Polyphenylene Sulfide (PPS), Glass Filled
Operating Tanperati : -
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