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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 18-3518-01

Aries Electronics - 18-3518-01

KEY Part #: K3357870

18-3518-01 Pricing (USD) [12101PC Stock]

  • 1 pcs$3.42270
  • 14 pcs$3.40567
Nimewo Pati:
18-3518-01
Manifakti:
Aries Electronics
Detaye deskripsyon:
CONN IC DIP SOCKET 18POS GOLD. IC & Component Sockets SURFACE MOUNT 18 PIN
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: D-Sub Connectors, Solid Eta Lighting Connectors, Solid Eta Lighting Connectors - Pwodwi pou Telefòn, Kontak, Prentan chaje ak chaje, Konèkteur Backplane - DIN 41612, Tèminal blòk - Pwodwi pou Telefòn - Jumpers, Tèminal - Konektè Fil Splice and Konektè rektangilè - Kontak ...
Avantaj konpetitif:
We specialize in Aries Electronics 18-3518-01 electronic components. 18-3518-01 can be shipped within 24 hours after order. If you have any demands for 18-3518-01, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

18-3518-01 Atribi pwodwi yo

Nimewo Pati : 18-3518-01
Manifakti : Aries Electronics
Deskripsyon : CONN IC DIP SOCKET 18POS GOLD
Seri : 518
Estati Pati : Active
Kalite : DIP, 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) : 18 (2 x 9)
Pitch - kwazman : 0.100" (2.54mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 10.0µin (0.25µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Open Frame
Revokasyon : Solder
Pitch - Post : 0.100" (2.54mm)
Kontakte Fini - Post : Tin
Kontakte Fini Epesè - Post : 200.0µin (5.08µm)
Kontakte Materyèl - Post : Brass
Materyèl Lojman : Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Tanperati : -
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