Advanced Thermal Solutions Inc. - ATS-61375R-C1-R0

KEY Part #: K6263789

ATS-61375R-C1-R0 Pricing (USD) [6512PC Stock]

  • 1 pcs$5.66740
  • 10 pcs$5.39813
  • 25 pcs$5.06082
  • 50 pcs$4.89221
  • 100 pcs$4.48730
  • 250 pcs$4.21739
  • 500 pcs$4.13304
  • 1,000 pcs$4.11617

Nimewo Pati:
ATS-61375R-C1-R0
Manifakti:
Advanced Thermal Solutions Inc.
Detaye deskripsyon:
MAXIGRIP FANSINK 37.5X19.5MM. Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 36.75x36.75x19.5mm, 36.75mm dia.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Pwodwi pou Telefòn, Fanatik AC, Tèmik - adezif, epoksi, grès, kole, Tèmik - adezif, epoksi, grès, kole, Tèmik - Kousinen, Dra, DC Fans, Fanatik - Pwodwi pou Telefòn - Fil Fan and Tèmik - tiyo Chalè, Cham vapè ...
Avantaj konpetitif:
We specialize in Advanced Thermal Solutions Inc. ATS-61375R-C1-R0 electronic components. ATS-61375R-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-61375R-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-61375R-C1-R0 Atribi pwodwi yo

Nimewo Pati : ATS-61375R-C1-R0
Manifakti : Advanced Thermal Solutions Inc.
Deskripsyon : MAXIGRIP FANSINK 37.5X19.5MM
Seri : fanSINK, maxiGRIP
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : BGA
Metòd Atachman : Clip, Thermal Material
Fòm : Square, Pin Fins
Longè : 1.476" (37.50mm)
Lajè : 1.476" (37.50mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.768" (19.50mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : 1.55°C/W @ 200 LFM
Rezistans tèmik @ natirèl : -
Materyèl : Aluminum
Materyèl Fini : Black Anodized

Ou ka enterese tou
  • 396-1AB

    Wakefield-Vette

    HEATSINK 3X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 76.2x35.1x127mm, 4 Mounting Holes

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • 122258

    Wakefield-Vette

    HEATSINK 15817 PROFILE 12. Heat Sinks Extrusion Cut to Length, 12 Inch, High Aspect Ratio, Heatsink 15817, 12x7.38x3.1 Inch

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.

  • PH3-50.8-12.7-0.21-1A

    t-Global Technology

    PH3 50.8X12.07X0.21MM.

  • PH3-101.6-25.4-0.21-1A

    t-Global Technology

    PH3 101.6X25.4X0.21MM.