40-3573-11 Pricing (USD) [4367PC Stock]
- 1 pcs$9.96685
- 7 pcs$9.91727
- Nimewo Pati:
- 40-3573-11
- Manifakti:
- Aries Electronics
- Detaye deskripsyon:
- CONN IC DIP SOCKET ZIF 40POS GLD. IC & Component Sockets QUICK RELEASE 40 PIN GOLD
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: FFC, FPC (Flat Flexible) Connectors, Keystone - Faceplates, kadr, Bannann ak Ide Connecteurs - Obligatwa Posts, Kowaksyal Connector (RF) - Kontak, D-ki gen fòm Connectors - Centronics, Kalite Connectors Pouvwa Kalite - Kontak, Konektè LGH and Bannann ak Tip Connectors - krik, ploge ...
- Avantaj konpetitif:
- We specialize in Aries Electronics 40-3573-11 electronic components. 40-3573-11 can be shipped within 24 hours after order. If you have any demands for 40-3573-11, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
40-3573-11 Atribi pwodwi yo
Nimewo Pati :
40-3573-11
Manifakti :
Aries Electronics
Deskripsyon :
CONN IC DIP SOCKET ZIF 40POS GLD
Seri :
57
Estati Pati :
Active
Kalite :
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
40 (2 x 20)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
10.0µin (0.25µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Closed Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Gold
Kontakte Fini Epesè - Post :
10.0µin (0.25µm)
Kontakte Materyèl - Post :
Beryllium Copper
Materyèl Lojman :
Polyphenylene Sulfide (PPS), Glass Filled
Operating Tanperati :
-
Ou ka enterese tou
-
40-6574-11
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS TIN. IC & Component Sockets QUICK RELEASE 40 PIN GOLD
-
228-1290-00-0602J
3M
CONN IC DIP SOCKET ZIF 28POS GLD. IC & Component Sockets 0.070" DIP SOCKET 28 Contact Qty.
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