ATS-61350K-C1-R0 Pricing (USD) [6806PC Stock]
- 1 pcs$5.42061
- 10 pcs$5.16324
- 25 pcs$4.84047
- 50 pcs$4.67918
- 100 pcs$4.29193
- 250 pcs$4.03378
- 500 pcs$3.95311
- 1,000 pcs$3.93697
- Nimewo Pati:
- ATS-61350K-C1-R0
- Manifakti:
- Advanced Thermal Solutions Inc.
- Detaye deskripsyon:
- MAXIGRIP FANSINK 35X35X14.5MM. Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 34.25x34.25x14.5mm, 34.25mm dia.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Kousinen, Dra, Tèmik - adezif, epoksi, grès, kole, Tèmik - tiyo Chalè, Cham vapè, Fanatik - Pwodwi pou Telefòn, Tèmik - adezif, epoksi, grès, kole, Fanatik - Pwodwi pou Telefòn - Fil Fan, DC Fans and Tèmik - Pwodwi pou Telefòn ...
- Avantaj konpetitif:
- We specialize in Advanced Thermal Solutions Inc. ATS-61350K-C1-R0 electronic components. ATS-61350K-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-61350K-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-61350K-C1-R0 Atribi pwodwi yo
Nimewo Pati :
ATS-61350K-C1-R0
Manifakti :
Advanced Thermal Solutions Inc.
Deskripsyon :
MAXIGRIP FANSINK 35X35X14.5MM
Seri :
fanSINK, maxiGRIP
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
BGA
Metòd Atachman :
Clip, Thermal Material
Fòm :
Square, Pin Fins
Longè :
1.378" (35.00mm)
Lajè :
1.378" (35.00mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.571" (14.50mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
1.90°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
-
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
Dènye nouvèl
Ou ka enterese tou
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
-
Pati cho
- 328990006
- ATS-61450W-C1-R0
- 6-1542005-1
- 5-1542005-9
- 821002B00000
- 822812B00000
- 411910B02500
- TXBF-019-025U
- TXBF2-050-033B
- 658-45ABT4
- 625-25ABT4
- 637-20ABP
- 634-20ABP
- 637-10ABP
- 7-402-000-BA
- 7-374-1-BA
- 7-374-2-BA
- PA2-1CB
- 7-339-2PP-BA
- 7-338-2PP-BA
- 7-311-BA
- RU67B1B
- 1542615-2
- 2-1963564-7
- 1-1963555-7
- 1-1963564-7
- 3-1542012-3
- 2-1963563-2
- 2-1963560-2
- 1-1963557-5
- 1-1963564-5
- 1-1963564-3
- 1542548-2
- 2-1963553-3
- 1-1963551-3
- 5-1961000-0
- 39880100120
- LAT0127B3CB
- UP1-TO3B
- 4-1542012-5