ATS-X53330P-C1-R0 Pricing (USD) [4849PC Stock]
- 1 pcs$8.86293
- 10 pcs$8.36859
- 25 pcs$7.49208
- 50 pcs$7.02379
- 100 pcs$6.55554
- 250 pcs$6.08728
- 500 pcs$5.97022
- Nimewo Pati:
- ATS-X53330P-C1-R0
- Manifakti:
- Advanced Thermal Solutions Inc.
- Detaye deskripsyon:
- SUPERGRIP HEATSINK 33X33X17.5MM. Heat Sinks BGA Cooling Solutions with superGRIP Attachment, High Performance, 33x33x17.5mm
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Kousinen, Dra, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Thermoelectric, Peltier Modules, Fanatik - Pwodwi pou Telefòn - Fil Fan, Fanatik - Pwodwi pou Telefòn, Fanatik AC, Tèmik - tèrmoelèktrik, asanble Peltier and Tèmik - Likid Refwadisman ...
- Avantaj konpetitif:
- We specialize in Advanced Thermal Solutions Inc. ATS-X53330P-C1-R0 electronic components. ATS-X53330P-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-X53330P-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-X53330P-C1-R0 Atribi pwodwi yo
Nimewo Pati :
ATS-X53330P-C1-R0
Manifakti :
Advanced Thermal Solutions Inc.
Deskripsyon :
SUPERGRIP HEATSINK 33X33X17.5MM
Seri :
superGRIP™
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
BGA
Metòd Atachman :
Clip, Thermal Material
Fòm :
Square, Fins
Longè :
1.299" (32.99mm)
Lajè :
1.299" (32.99mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.689" (17.50mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
4.10°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
-
Materyèl :
Aluminum
Materyèl Fini :
Blue Anodized
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