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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 44-6553-10

Aries Electronics - 44-6553-10

KEY Part #: K3356319

44-6553-10 Pricing (USD) [7827PC Stock]

  • 1 pcs$5.29183
  • 56 pcs$5.26550
Nimewo Pati:
44-6553-10
Manifakti:
Aries Electronics
Detaye deskripsyon:
CONN IC DIP SOCKET ZIF 44POS TIN. IC & Component Sockets DIP TEST SCKT TIN 44 PINS
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèminal - Konektè Fil Splice, Kowaksyal Connector (RF) - Kontak, Konnektè Konnen, Konèkteur Backplane - Kontak, Barik - Pouvwa Konektè, Modilè Konektè - Pwodwi pou Telefòn, Konektè LGH and Modilè Konektè - ploge ...
Avantaj konpetitif:
We specialize in Aries Electronics 44-6553-10 electronic components. 44-6553-10 can be shipped within 24 hours after order. If you have any demands for 44-6553-10, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

44-6553-10 Atribi pwodwi yo

Nimewo Pati : 44-6553-10
Manifakti : Aries Electronics
Deskripsyon : CONN IC DIP SOCKET ZIF 44POS TIN
Seri : 55
Estati Pati : Active
Kalite : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) : 44 (2 x 22)
Pitch - kwazman : 0.100" (2.54mm)
Kontakte Fini - Kwazman : Tin
Kontakte fini epesè - kwazman : 200.0µin (5.08µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Closed Frame
Revokasyon : Solder
Pitch - Post : 0.100" (2.54mm)
Kontakte Fini - Post : Tin
Kontakte Fini Epesè - Post : 200.0µin (5.08µm)
Kontakte Materyèl - Post : Beryllium Copper
Materyèl Lojman : Polyphenylene Sulfide (PPS), Glass Filled
Operating Tanperati : -
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