[44PC Stock]
- Nimewo Pati:
- HMC-C007
- Manifakti:
- Analog Devices Inc.
- Detaye deskripsyon:
- INGAP HBT DIVIDE-BY-8 MODULE 0.5. RF Modules InGaP HBT Divide-By-8 Module, 0.5-18 GHz
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: RF kontwolè pouvwa ICS, RF Evalyasyon ak Devlopman Twous, Boards, RF diplexèks, RF modilatè, Evalyasyon RFID ak twous Devlopman, Boards, Antenne RFID, RF Misc ICS ak Modil yo and Atenuateur ...
- Avantaj konpetitif:
- We specialize in Analog Devices Inc. HMC-C007 electronic components. HMC-C007 can be shipped within 24 hours after order. If you have any demands for HMC-C007, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
HMC-C007 Atribi pwodwi yo
Nimewo Pati :
HMC-C007
Manifakti :
Analog Devices Inc.
Deskripsyon :
INGAP HBT DIVIDE-BY-8 MODULE 0.5
Seri :
-
Estati Pati :
Active
Fonksyon :
Divide-by-8
Frekans :
500MHz ~ 18GHz
RF Kalite :
VSAT
Atribi Segondè :
-
Pake / Ka :
Module, SMA Connectors
Pake Aparèy Founisè :
Module
Dènye nouvèl
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