Nimewo Pati :
SMDSWLF.006 50G
Manifakti :
Chip Quik Inc.
Deskripsyon :
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Konpozisyon :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Pwen fizyon :
423 ~ 428°F (217 ~ 220°C)
Kalite Flux :
No-Clean, Water Soluble
Fil Kalib :
34 AWG, 38 SWG
Fòm :
Spool, 1.76 oz (50g)
Tanperati Depo / Refrijerasyon :
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