BDN13-3CB/A01 Pricing (USD) [28512PC Stock]
- 1 pcs$1.27362
- 10 pcs$1.23925
- 25 pcs$1.20576
- 50 pcs$1.08037
- 100 pcs$1.01682
- 250 pcs$0.95327
- 500 pcs$0.92149
- 1,000 pcs$0.82617
- 5,000 pcs$0.81028
- Nimewo Pati:
- BDN13-3CB/A01
- Manifakti:
- CTS Thermal Management Products
- Detaye deskripsyon:
- HEATSINK CPU W/ADHESIVE 1.31SQ.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik - Pwodwi pou Telefòn, DC Fans, Tèmik - Kousinen, Dra, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - adezif, epoksi, grès, kole, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Thermoelectric, Peltier Modules and Tèmik - adezif, epoksi, grès, kole ...
- Avantaj konpetitif:
- We specialize in CTS Thermal Management Products BDN13-3CB/A01 electronic components. BDN13-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN13-3CB/A01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BDN13-3CB/A01 Atribi pwodwi yo
Nimewo Pati :
BDN13-3CB/A01
Manifakti :
CTS Thermal Management Products
Deskripsyon :
HEATSINK CPU W/ADHESIVE 1.31SQ
Seri :
BDN
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman :
Thermal Tape, Adhesive (Included)
Fòm :
Square, Pin Fins
Longè :
1.310" (33.27mm)
Lajè :
1.310" (33.27mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.355" (9.02mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
6.00°C/W @ 400 LFM
Rezistans tèmik @ natirèl :
16.10°C/W
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
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